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TI is aware of the recently reported Bluetooth® Low Energy spoofing attack (BLESA) vulnerability, which may occur within certain, allowable use of Bluetooth Low Energy. Customer applications that use TI CC26xx, CC13xx or CC254x devices should use available services in the TI Bluetooth Low Energy SDKs to apply recommended mitigations as noted below.
The BLESA vulnerability describes two scenarios in which the attacks may potentially succeed: 1. If bonding was established between two devices and the Generic Attribute Profile (GATT) client trusts the server with a response for a service request with ‘insufficient encryption, authentication or authorization 2. The GATT client continues with an unencrypted link with the server in case encryption request fails with the previously bonded devices
Based on the current analysis of the vulnerability, the recommended mitigation is for the application to ensure that any access to GATT characteristics that require an encrypted, authenticated or authorized link cannot be achieved without the needed security restrictions at the service level. The recommended mitigation is applicable to applications that incorporate the Generic Access Profile (GAP) central role to (i) initiate encryption once a connection is established with a previously bonded device and (ii) in case the encryption process fails, because the peer does not have the long term key (LTK), either re-initiate pairing or terminate the link.
The Gap Bond Manager in TI Bluetooth Low Energy SDKs for CC26xx/13xx and CC254x devices (see SDK links in table below) provides the needed services to apply the recommended mitigations for the application. The Gap Bond Manager initiates encryption with previously bonded devices and allows the user to configure the device to either initiate pairing again or terminate the link by setting gapBond_BondFailOption parameter.
CC2640R2 SDK BLE-STACK
CC2640R2 SDK BLE5-STACK
BLE-STACK (support for CC2540/CC2541)
BLE-STACK (support for CC2640/CC2650)
CC13x0 SDK, BLE-STACK
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