CC2420: Thermal Resistance: Junction To Ambient

Yash,

Thanks for your inquiry. I notified a colleague and he will provide further insights as soon as possible.

Best regards,

Rafael

Rafael,

Do you have any updates regarding this issue?

I found an old datasheet online and looks like this section was deleted in the new datasheet.

The old one states that the thermal resistance of this device is 25.6K/W

Here is the link to the same. https://inst.eecs.berkeley.edu/~cs150/Documents/CC2420.pdf.

This data is on page 83 of the document. Can you confirm if this number is still valid?

Thank you,

Yash.

Hi,

That was a different package (i.e. QLP 48). I will confirm if that is true for RGZ.

reagrds

Hi,

I am afraid I don't have a number for this part for RGZ package at the moment but heat transfer should not be an issue for this device due to its low power.

I believe it should be on par with our other RGZ parts in thermal performance.

See e.g. CC2640, CC2642 data.

https://www.ti.com/lit/gpn/cc2640

https://www.ti.com/product/CC2642R

Regards