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CC2652P7: CC2652P7 evaluation kit

Poh Kok Keng
Genius 5472 points
Part Number: CC2652P7
Other Parts Discussed in Thread: CC1352P7, LP-CC1352P7, LP-CC2652R7, LP-CC2651P3

Tool/software:

Dear Support,

My customer plan to evaluate CC2652P74T0RGZR with evaluation kit with OTA features. The closest I found is 

LP-CC1352P7

Can I check if I get this board, can I desolder and replace it with CC2652P74T0RGZR  for it to work with CC2652P7?

Customer want to test BLE function with

1. 20dbM transmit power

2. OTA function

Best regards,

kpk

  • 0
    TI__Guru**** 214527 points

    Hi kpk,

    The CC2652P7 is pin compatible with, and functionally identical to the CC1352P7 device for 2.4 GHz operation. You can run CC1352P7 software examples on the CC2652P7 device without making any changes, and swap the devices on the LaunchPad without any concerns.  software-on-cc2652p.html 

    Regards,
    Ryan

  • 0 in reply to Ryan Brown1
    Genius 5472 points

    hi Ryan,

    Thx, Can i get your opinion if I should get 

    LP-CC2652R7 instead of LP-CC1352P7 for easy migration later to CC2652P7?

    Customer also need to test OTA functionality. 

    Best regards, KPK

  • 0 in reply to Poh Kok Keng
    TI__Guru**** 214527 points

    You should use the LP-CC1352P7 if you intend to adopt the CC2652P7 in your final hardware version.  This presents no issues with OTA adoption.

    Regards,
    Ryan

  • 0
    Prodigy 60 points

    Hi,

    FYI

    • The LP-CC2652R7 evaluation kit does not support a power amplifier (PA).
    • The LP-CC1352P7-4 evaluation kit supports a PA, providing +10 dBm for the Tx path. However, components need to be changed to achieve +20 dBm for the Tx path.
    • The LP-CC2651P3 evaluation kit supports a PA with +20 dBm for the Tx path but does not support On-Chip OAD due to limited flash size. (Desolder the existing component and replace it with the CC2652P74T0RGZR.)

    For additional options, a custom PCB design may include +20 dBm for the Tx path using the CC2652P74T0RGZR. I am currently reviewing the schematic and peripheral components for the RF path.

    Best regards,

    Bank