Hi,
I am using CC1101 (and CC1100 before) in a non optimized PCB: as I had very little space, all inductors, capacitors and resistors were put on the PCB in a "compact" way. The chip is working, but I obviously have short range and reliability problems.
At the moment, I am redisigning all the project, and would like to make the RF section as solid and reliable as possible. As I am not an expert, I only design the schematics, while the PCB is designed by an external company; but I have to explain all the constraints, and I'm afraid I can commit some fatal error.
I read through most forum and FAQ posts, besides AN and DNs and the reference board documentation, but I still have many doubts, which I will explain in the following lines. But first of all, I apologize if this post will be long and maybe confusing; still, I hope you can help me.
Background: a wireless sensor network, in which the RF section is composed by CC1101 at 433 MHz. Range and data rate should be as high as possible; at the moment I use GFSK at 100 kbps, and the range in LOS (@10 dBm) is about 40-50 m, but the communication fails often when I try to send many packets one after another. Moreover, it is a multichannel system, so I need to use all 256 channels.
These are my doubts:
1. I see on the reference board the PCB is a 2 layer FR4, 0.8 mm thick; moreover, two connectors are present on it, which carry all signals of the MCU front end. I need to use a 4 layer PCB, as the board is complex, and it could be better if the RF section could not be on a separate board. Is it possible to use 4 layers and remove those connectors? If it is, what margins have to be considered in order to minimize noise towards the RF section?
2. I read this post http://e2e.ti.com/forums/t/1726.aspx in which the problem of the mechanical resistance of the SMA connector is raised. I'm afraid I will have the same problem; thus I would like to know if there is any news about that (Richard Wallace states that a through-hole SMA connector will be used in the next versions of EM boards).
3. On the reference board a 0402 ferrite bead is included in the power line of CC1101, but there's no reference to any specific part. Have you got any suggestion?
4. What kind of other precautions do I have to take in order to improve the stability and reliability of the RF section? I read this thread: http://e2e.ti.com/forums/t/136.aspx and am a little confused... should I have to put an ESD diode, a 10k+ resistor, a coil, an ESD protection chip... one of them or all of them? And how can I insert them in the reference design without losing performance?
5. In some documents a filter to cut noise at 699 MHz was added near the antenna; should I use it even if I work at 433 MHz?
6. In a place with high electro-magnetic fields (i.e. a railway station) I noticed that the boards absorbed more current, thus reducing the battery life. Could the absence of ferrite beads or other protections lead to similar results?
7. In CC1101 data sheet it is stated that the use of wire wound inductors at 868 and 915 MHz can lead to a small improvement in the output power. Is it true at 433 MHz as well? If it is, what wire wound inductors could be used?
8. Until now, I've been using a 27 MHz crystal. Is it a good choice? What are, basically, the differences between a 26 and a 27 MHz crystal? The only differences (of the 26 MHz with respect to the 27 MHz) I can see are a smaller channel filter bandwidth and longer typical times (calibration and others). Is there something more?
9. I read that in a relativley short time CC1190 will be available, which could lead to have a simple way to extend CC1101 range. But will it work at 433 MHz? And, if not, how can I add a LNA in order to improve CC1101 sensitivity (I prefer not to use a PA, as, from what I can understand, 10 dBm is the law limit in Europe).
10. I use a switching DC-DC converter to power CC1101 at 2.5V. Is it good, or should I take something more into account?
I know it's A LOT of questions, but I still hope someone can help me.
Many, many thanks in advance.
Stefano