Need a SMD to DIP converter for IC CC1101.

Note that both CC1101 and CC1070 have the ground connection on the die paddle under the chip. It is very important that this is solid grounded as shown in the reference designs. Note that if you need to use a socket this has to ensure good RF connection on all pins. It exist sockets used in test equipment but those are expensive. My assumption is that you want a SMD to DIP for ease of soldering?

i am actually developing a module, and for this I need to test the IC and program it according to my use. For this I need it in DIP so I can fix it on breadboard and experiment with it.

For that use I would highly recommend getting som EVMs and then connect the EVM to your MCU via SPI interface. Using a breadboard for RF is not a good idea.

where can I find the schematic, BOM and layout Gerber files for these ICs?
I can get the IC soldered on a PCB and then take out the pins to use it. Is it possible for these ICs?

See http://www.ti.com/tool/cc1101em868-915_refdes and http://www.ti.com/tool/cc1101emk868-915

I will not be using this IC for 800 MHZ, but will program it for 402-405 MHZ (MICS standard). Will these layout and Gerber files be okay? I just want it to take the pins out and not use it along with the external components that given in the layout. I will just be using the IC soldering portion. Do I have to make the layout on my own or will these work?

If you look under www.ti.com/product/cc1101 you will also find reference designs for the 400MHz bands. Again: Most of the external components have to be placed close to the chip to ensure functionallity/ performance. Use the EM for testing and use wires only for the SPI interface and the power.

Thanks..

Even better, check out Anaren's AIR modules for the CC110L:

http://www.anaren.com/air/cc110l-air-module-boosterpack