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TRF7963A: The Thermal Pad connected to Ground

seo daeho
Prodigy 10 points
Part Number: TRF7963A

- if the thermal pad is not connected properly to the ground, 

  can the "TRF7963A" malfunction at the environmental temperature (low or high temperature)?

  • 0
    TI__Mastermind 18265 points
    Hello,

    the main purpose of the Thermal Pad is to help dissipate heat from package.
    If the pad is not connected properly to the board the device can heat up.
    As long as the specified junction temperature of 125 C is not exceeded you should not have any malfunction.
    It is not possible for me to give a judgement if this temperature can be exceeded in you case.

    To avoid any thermal stress to the device try to establish a good contact to the board.

    Best regards,
    Helfried