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CC3220MODA: CC3220MODASM2MONR Surface Mounting Questions

Part Number: CC3220MODA

I have some technical questions about surface mounting the CC3220MODASM2MONR microprocessor

1. The solder paste composition in “Soldering and Reflow Condition” (Section 11.5 of SWRS206E data sheet for CC3220MODx and CC3220MODAx modules) documentation is listed as "Sn/3.0 Ag/0.5 Cu", is this particular solder paste composition required or can other solder paste compositions be used?

2. If another solder paste is used, do we use the same reflow temperature profile as the listed solder paste?

3. “Peak temperature” in same “Soldering and Reflow Condition” documentation is listed as 245 C, is this the maximum heat tolerance of the MCU? Or what is the maximum heat tolerance of the MCU?

Thank you for any help!