Other Parts Discussed in Thread: WL1837, WL1835
Tool/software:
Hi, We are having similar issues with WL1837 (we have used WL1835 on a different pcb for years with no issue).
As this is a new Rev, I have modified artwork to make solder require less heat to reflow by thermal relief of pad design.
I have stressed to CM in a CAR the reflow profile TI recommends.
Left is REV3 masking instruction, center is REV2 right is REV3.
Are there any layout improvements that can be made?
Do you have specific material recommendation for the IC masking? - Patrick
