• State Resolved
  • Locked Locked
  • Replies 9 replies
  • Subscribers 42 subscribers
  • Views 197 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

WL1837MOD: Die connection difference between 2015 DC and 2022DC

Aron van Wijk
Prodigy 10 points
Part Number: WL1837MOD
Other Parts Discussed in Thread: CC3220MOD,

Tool/software:

Hi Team,

I was wondering if you were able to tell me if there was a change in the die connection & format marking for this part over the last years?

We have a situation where the die connection and format marking from 2015 looks different to the one with 2022 DC.

It would be great if you can shed some light on this.

Regards,

  • 0
    Guru 76665 points

    Hi,

    What exact issue do you see? It seems that bond wires inside RF switch Skyworks SKY13374 is slightly different (that means this is not even TI part). But x-ray exposure is slightly different and this may to be misleading.

    Jan

  • 0 in reply to Jan D
    Prodigy 10 points

    Hi Jan,

    Thanks for the reply. 

    I am a little confused as to what you mean by Skyworks SKY13374 part? I am looking at the data sheet but I don't see any mention of this part. 

    We are just wondering why an Xray from 2015DC would look different from 2022DC for the same part number. 

    Regards,

  • 0 in reply to Aron van Wijk
    Guru 76665 points

    Hi,

    Inside module is many components (WL18 chip, capacitors, resistors, xtal, filter, etc.). One of these components is RF switch from Skywork. At your Xray image you see bond wires inside this RF switch. For more details what is inside module you can check images at FCC page.

    It seems that metal shielding is slight different material and this can affect Xray attenuation and exposure.

    Jan

  • 0 in reply to Jan D
    Prodigy 10 points

    Thanks. 

    One last thing. Does the LTC lot trace code come from TI. Are you able to confirm that? 

  • 0 in reply to Aron van Wijk
    Guru 76665 points

    Hi,

    I am not able confirm origin of this exact LTC code. You will need wait for answer from TI.

    But material of shielding and lasered marking looks exactly same as at more recent TI modules (CC3220MOD, CC3235MOD). As far I know TI have multiple contractors which are manufacturing modules. If I should speculate, your module may to be assembled at another TI contractor. For more details you can wait for answer from TI.

    Jan

  • 0 in reply to Jan D
    TI__Mastermind 44570 points

    Hi Aron,

    Are you asking because you feel you have a counterfeit module? I'm still not sure what the issue is here. As Jan mentions, we do have multiple manufacturing sites so its possible to see slight differences - it looks like the image comparison just shows the ink not showing up on the bottom symbols.

  • 0 in reply to Dylan Hubbard
    Prodigy 10 points

    Hi Dylan,

    Thanks for your answer.

    Does the LTC lot trace code come from TI. Are you able to confirm that? 

    We are asking because we weren't sure as to why the Xray would have different results. I am attaching another photo that shows 2 with the same DC and one from 15+

    One of the 22DC matches with the 15+ DC but the other one is quite different which is the cause for concern.

    What would be the explanation for this? 

  • +1 in reply to Aron van Wijk
    TI__Mastermind 44570 points

    Hey Aaron,

    As Jan has mentions, the IC you are providing XRAYs for is not manufactured at TI. This means we have no control over how they bond our their pads. IF this is the main concern for your question, then this forum is not going to solve this - it would be better to reach out to Skyworks directly. From the data sheet- I see no difference in performance.

    The LOT trace codes printed on the Module shield do come from TI - if you have purchased these from our store then there should be no concern. I would be more concerned if the components under the shield had differences in assembly as that shouldn't be the case for the same Module part number.

  • +1 in reply to Dylan Hubbard
    Guru 76665 points

    Hi Aron,

    No. You cannot evaluate bond wires of chip by simple 2D x-ray. You will need have multiple images from different angled or even better 3D x-ray scan (CT scan). Chips even at same batch can have bond wires which can look differently.

    If you really want to compare difference of bond wires of SKY13374 you should:

    • remove shielding of WL1837MOD
    • dismount SKY13374 from PCB
    • get X-ray photos from at least three angles (or 3D scan)
    • ask Skyworks support for evaluation of these photos

    btw... there was PCN about changing test site of SKY13374 a 2019.

    Jan