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CC3301MOD: What are the reflow profile and MSL information for CC3301MOD?

Jesse Wang
Intellectual 2555 points

Part Number: CC3301MOD
Other Parts Discussed in Thread: CC3300MOD

Tool/software:

Hi TI expert,

 Could you provide the reflow and MSL information for CC3300MOD?

 These can't be found on datasheet nor https://www.ti.com/quality-reliability-packaging-download/report?opn=CC3301MODENIAMOZR.

BR, Jesse.

  • 0
    TI__Intellectual 2925 points

    Hey Jesse,

    CC33xxMOD has a MSL rating of MSL4. Please allow me a moment to gather the Reflow Information for you. 

    Best,

    Josh

  • 0 in reply to Josh Smith
    TI__Intellectual 2925 points

    Hey Jesse,

    Please see the reflow information here:

    Solder paste alloy: S3X58-M500 KOKI (Sn96.5, Ag3.0, Cu0.5)

    Pre-heat temperature: 150℃ ~ 180℃; Soak time: 60 seconds ~ 120 seconds

    Peak temperature: 260℃

    Time above 217℃: 60 seconds ~ 120 seconds

    Time above 260℃: 7.5 seconds

    Optimal heating rate: 3℃/second

    Optimal cooling rate: -3℃/second

    Hope this helps.

    Best,

    Josh