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WL1805MOD: Solder Voiding on inner ground pads using recommended footprint

Part Number: WL1805MOD

I apologize for the delay in responding.  Is there an email address I can use to provide the requested files?  I have the stencil file, the reflow profile, and example xrays of the voiding.

This is in response to the following topic: https://e2e.ti.com/support/wireless-connectivity/wifi/f/968/t/873286

Thanks.