CC3220MODA: CC3220MODA symbol/footprint error importing to EAGLE

Stuart Robertson

Part Number: CC3220MODA

Hi,

Application working well on Launchpads and now designing PCB. Unfortunately can't get the CC3220MODA symbol/footprint imported into EAGLE without errors.

I've installed Ultralibrarian and the CC3220MODA_MON_63.bxl file loads nicely into the app (symbol and footprint look good).

Exporting to EAGLE generates the required .scr (script) file.

Executing the .scr file in EAGLE however generates the error message "Pad name 'V' already exists!". This error message repeats for multiple lines.

If you click 'through' the errors then at the end the symbol for the schematic looks good but the footprint is corrupted in the thermal pad areas.

Possible to get this fixed so I can progress my design ?

regards,

Stuart

over 6 years ago

0 Seong Kim over 6 years ago

TI__Mastermind 46261 points

Stuart,

Which version of Eagle are you using?

BR,

Seong

0 Stuart Robertson over 6 years ago in reply to Seong Kim

Intellectual 840 points

Hi Seong,

I'm using the latest: 9.4.2.

best regards,

Stuart

0 Seong Kim over 6 years ago in reply to Stuart Robertson

TI__Mastermind 46261 points

Stuart,

Try using this one -> CC3220MODA_MON_63.bxl

BR,

Seong

0 Stuart Robertson over 6 years ago in reply to Seong Kim

Intellectual 840 points

Hi Seong,

Many thanks for your prompt support.

Unfortunately the same error messages were generated and the footprint corrupted.

regards,

Stuart

PS. Maybe you already know but you can download Eagle for free (limited version) to see first hand the problem.

0 Seong Kim over 6 years ago in reply to Stuart Robertson

TI__Mastermind 46261 points

Stuart,

I've reported this issue to our CAD team. I'll get back to you as soon as I hear back from them.

BR,

Seong

0 Seong Kim over 6 years ago in reply to Stuart Robertson

TI__Mastermind 46261 points

Hey Stuart,

Our CAD team fixed the issue and updated the BXL. Try using this one

CC3220MODA_MON_63.bxl

BR,

Seong

0 Stuart Robertson over 6 years ago in reply to Seong Kim

Intellectual 840 points

Hi Seong,

Many thanks. I've tried it and while the error messages have disappeared I'm still left with what I believe is a corrupted thermal pad area when I use the footprint in Eagle. I've attached a couple of screen captures to help in debug.

The first file: UL_import.PNG is how it looks when importing the BXL file to UltraLibrarian.

The second file: Eagle_PCB.png is what it looks like when the SCR file is imported to Eagle.

Clearly they're quite different in that thermal pad area. Schematic symbol import looks perfect.

Note that It may be that its still good as the thermal pads should all be connected to GND. In the BXL import to UL a crosshatch is used to connect all 9 thermal pads together while on the Eagle_pcb it looks more of a flood fill. My concern may be in manufacture making good reflow connections in a large copper area (?)

best regards,

Stuart

UL_import.png

Eagle_pcb.png

0 Seong Kim over 6 years ago in reply to Stuart Robertson

TI__Mastermind 46261 points

Stuart,

The crosshatch in UL may be a default visibility setting. Our EVMs are all designed with a solid copper pour as shown in your image, Eagle_pcb.png.

The hatched planes are rarely used now a days. Hatched polygons were used to avoid manufacturing issue. Gas pockets will be formed between the layers during wave soldering and hatched polygons helps the gas pockets escape through the gaps. With the advance in technology, this issue is not there anymore.

However, if you'd like to use hatched copper, you can edit this as shown below.

EAGLE Tool : Right click on plane à Properties àchoose hatched next to polygon pouràenter required spacing.

For larger thermal pads, it is not recommended to create the solder paste layer 1:1 of thermal pad. Cross hatching is the recommended pattern.

Cross‐hatching will prevent excessive amount of applied solder paste, thus reducing the risk of solder bridging ( Unintentional connection between two points during assembly ).

The primary concern with a full‐pad solder‐paste application is “floating”—an excessive amount of solder between the thermal pad and the PCB can cause the entire component to float above the level at which the perimeter lands can make contact with their pads.

BR,

Seong

0 Stuart Robertson over 6 years ago in reply to Seong Kim

Intellectual 840 points

Many thanks Seong for the excellent explanation and support !

regards,

Stuart

0 Seong Kim over 6 years ago in reply to Stuart Robertson

TI__Mastermind 46261 points

No problem. I'll be closing this thread. Please start a new one for any other queries.

BR,

Seong

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CC3220MODA: CC3220MODA symbol/footprint error importing to EAGLE