Background and problem definition:
TI provides a calculated RF balun for the PCB stack-up where the width of a single-ended 50ohm trace is roughly equal to 12.5 mils. Once we want to integrate AM335x and CC13x2 on the single PCB, we have to use a stack-up with a width of a single-ended 50ohm trace roughly equal to 5-5.5mil. Unfortunately, it's not possible to use RF balun from the reference designs because the PCB stack-up change is too significant.
Would you help us to find (at least) theoretical values and component placement for RF balun (CC1352R1) for a given PCB stack-up?