My customer is having some production issues and is looking to implement 100% X-ray AOI during assembly. They are asking if we have any information around if this is safe to do or not and if it will / could damage TI components? They specifically use the CC2430F128RTCR on this particular PCBA but any TI info regarding this topic is appreciated.
They found the below IEEE white paper showing degradation to DRAM performance after low dosage x-ray AOI. I know lots of customers do this kind of inspection but I cannot find any documentation specific to x-ray AOI.
Any help is much appreciated!