Other Parts Discussed in Thread: CC2630
Customer looking for CC2533 as it is not in the datasheet
Thermal Parameters: Ɵjc (C/W),Ɵjb,Ɵja.
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Lawrence,
As you can imagine, unfortunately we do not have thermal characteristics information publicly available for this device.
I am contacting some folks that might be able to either provide this information or additional insights about its availability.
I will get back to this thread.
Best regards,
Rafael
Lawrence,
I got additional information about this.
Back when the CC2533 datasheet was released, there were no requirements for thermal characterization and therefore this was not tested.
One aspect is that, since the thermal characteristics are very similar across similar packages and device power, a good estimate can be done with the newer device CC2630 using the RHB package (CC2630F128RHB). Check section 5.10 of its datasheet:
https://www.ti.com/lit/ds/symlink/cc2630.pdf
Hope this helps,
Rafael