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CC2640: Risk of Damage if using Ultrasonic Welding

David C
Expert 3350 points
Part Number: CC2640

Hello,

I have a customer who is thinking of moving away from using glue and a plastic enclosure to ultrasonic welding.

Is there a risk of damage for the cc2640 (or its crystal and oscillator) if using ultrasonic welding?.

Regards,

David

  • 0
    TI__Mastermind 19135 points

    Hey David,

    I would need to find someone in packaging that could answer this question. It might take some time for me to get this for you.

    Regards,
    AB

  • 0 in reply to AB
    TI__Expert 3350 points
    AB,

    Please email me or call once you have an answer.

    Regards,
    David
  • 0 in reply to David C
    TI__Mastermind 36375 points

    David,

    Based on internal feedback from Quality and Packaging folks here at TI, we have come to this conclusion.

    • Ultrasonic welding is not recommended for QFN packages, nor our newer WCSP packages.
    • Ultrasonic welding for enclosures, where TI devices are on circuit boards inside. There we believe the outcome is going to be highly dependent on the details of the process, proximity of the welding to the components, does any of the ultrasonic energy propagate into the TI chip, etc. We are not able to make a general statement about that. 
    • Link to wiki about the process in question.

    Regards,
    /TA