Part Number: CC3220
Can anyone explain what is behind the need to a min/max ambient thermal slew rate? Does it have to do with calibration, stress on the device or some other parameters?
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Part Number: CC3220
Can anyone explain what is behind the need to a min/max ambient thermal slew rate? Does it have to do with calibration, stress on the device or some other parameters?