OPA27: OPA27 Thermal Rise Information

Part Number: OPA27

Tool/software:

Is there thermal rise information available for OPA27AJG?  I am looking for the thermal rise between the case and junction.

  • Hi Andrea,

    Is there thermal rise information available for OPA27AJG?

    I am not clear what OPA27AJG is. The image below is the basic thermal information about OPA27. The part is rated from -40C to +85C and it is not design to have higher power dissipation, where the abs. max. power dissipation is <0.5W.  

    To estimate the thermal rise, I will need to know what is power dissipation in this part in an actual application? The thermal information can be simulated, if we can provide the package information about OPA27AJG. The thermal model should provide a fairly accurate prediction upon request. If I have the power dissipation figure in actual application, the thermal rise can be calculated. 

    If you have other questions, please let me know. 

    Best,

    Raymond 

  • Hi Raymond,

    Thanks for your prompt response!

    In the datasheet, there is a table of available options for the part.  We will be using the OP27AJG, which is the ceramic DIP package. 

    The dissipation is 0.096W.

    Thanks,

    Andrea

  • Hi Andrea,

    The dissipation is 0.096W.

    This is OP27AJG. I was confused with OPA27 somehow 

    For OP27AJG, the max. power rating is 210mW at Tamb = 125C. If the application is dissipating 96mW of power, the JG product will be operating well within the SOA. 

    If you are interested to find thermal metric information in this part, we can do the thermal metric model request via the site below. We are able to submit the thermal model request to get the thermal metric information, then we can estimate the temperature delta at a given Tamb. Based on what I see, the OP27AJG does not issues in operating up to Ta = 125C with 96mW of power dissipation. 

    https://sps16.itg.ti.com/sites/HPA_PKG/Lists/Thermal%20Model%20Request%20Form3/Thermal%20Models.aspx

    Best,

    Raymond

  • Hi Raymond,

    I attempted to submit the thermal metric model request, but the link doesn't work when I click on it.  Is there another way to submit a request?

    Thanks,

    Andrea

  • Hi Andrea,

    This is TI's internal link, and you may not have rights to access it. I may have to submit for you. 

    Are you only interested to know the temperature rise of the JG product? Assume the part is operating at the worst case scenario with Ta = 125C, 96mW is only 46% of the allowed power dissipation threshold. The max. Tj is likely higher than 150C in this part and the part should be operating well within the safe thermal limit. 

    It will take up to a week or more to get these thermal metric figures, if you are interested. Please let me know. 

    Best,

    Raymond

  • Hi Raymond,

    Thanks for the quick response.  Yes I am interested, and can wait the week for the response.  Thank you for submitting this request.

    Thanks again,

    Andrea

  • Hi Andrea,

    I will submit the thermal modeling request for you. Please remind me after 2/27th, if I did not have a chance to get it back to you. 

    Best,

    Raymond

  • Hi Andrea,

    Here is the thermal information about the OP27AJG op amp. 

    The temperature delta or thermal rise  = 0.1W*55C/W = 5.5C delta (based on Theta JC, top surface). If you take JB theta figure, the thermal rise is approx. 9.6C above Tamb, where Tamb is from -55C to 125C in range. 

    This is the package type for OPA27AJG: 

    If you have other questions, please let me know. 

    Best,

    Raymond