Other Parts Discussed in Thread: ISOW7744, ISOW7743
Hi,
We were initially using the competitor of ISOW7844 on one of new project in developing and saw similar Emission spikes as in the figure.3 of SLLA368C. So we are considering to change to ISOW7844 and have this questions:
Per SLLA368C, use 3.3V input supply if possible. Currently our design is 5V in / 5V out. If it is changed to 3.3V in / 5V out, would it be better for EMC? Or it would only be improved with 3.3V in / 3.3V out?
SLLA368C suggests to use interlayer stitching capacitance, but we will have trouble to use this strategy but still meet separation distance requirement for medical device requirement (IEC 60601-1), but we can apply stitching vias along the board edges. But I don't see much explanation in SLLA368C regarding this mitigation method, but just a note in Figure 6. Please let me know that also helps.
Thanks,