Hi Experts,
Good day.
From SPRABB3 document section 20 VIAS (page 15), it is suggested that a mechanical drill can be used to make a 10 mil via with 5 mil hole. Is this just for a via from outer layer to next layer down, or is this for a thru via? If for a thru via, what thickness PCB would this work with?
Query is raised by a customer. Thanks ahead for your support.
Regards,
Archie A.