TAS5630B samples have been available since August but I have not yet seen a datasheet or production parts. When will these be available?
Russ
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RTM should happen within a week.
Preview folder with datasheet is already available on ti.com
Regards,
Preethi Sundaresan
Home Audio Product Marketing
Texas Instruments
The new TAS5630B specifications are curious.
1. Maximum output offset voltage is down from 150mV to 50mV now. That is good, but not as good as the expected 30mV (from the forum) .
2. Maximum output power in PBTL mode is down from 600W to 400W now. (See #4 below)
3. Thermal ratings are much different from those of the TAS5630. Different ratings are given so they are hard to compare directly. The DKD package ratings are now mostly worse than the PHD package ratings, despite the DKD package having a larger thermal tab. That seems counter-intuitive.
4. Minimum and nominal load resistances for PBTL mode are now higher than previously. What changed?
5. Minimum load resistances for BTL and PBTL modes are higher than for SE mode for both TAS5630 and TAS5630B. That also seems counter-intuitive.
Are there any simple explanations for #3, #4, and #5?
Russ
Russel,
One key goal of the "B" version was improved reliability. A number of small changes have been made to the device to guarantee increased robustness.
2. 4. The decreased rating of PBTL power was to add robustness margin in this mode, We have seen cases where the large in-phase current caused issues in customer implementations.
3. That's a mistake. Good catch, -we are working on a new set of thermal parameters. There is no doubt that the DKD package is thermally better than the PHD package.
5. Each half bridge output sees half the load impedance in BTL, quater of the load impedance in PBTL and the full load impedance in SE. Imagine a virtuel DC voltage source at half the supply voltage connected to the mid point of a BTL or PBTL load. This corresponds exactly to the connection of the SE load to a DC blocking capacitor or a split capacitor for AC coupling.
Other canges to the "B" versions are:
-Improved DC offset as you mention
-Improrved ruggedness
-Improved crosstalk
-Disabling /CLIP in RESET, ramping and SaF states
-READY signal signal not influenced by current limiting (CB3C)
-Moisture resistance improved to MSL level 3
Best regards
Søren