Part Number: IWR1642
In 1642 demo, i tried to modify the SOC_AR16XX_DSS_L2_BUFF_SIZE to larger 0x10000 (L2RAM has a 128KB for each UMAP), and the linker will give out an error here.
So what is the limit and how can i modify this?
is L2RAM proccessing faster than L3RAM? So is it possible to move some variable or array (e.g. detmatrix) to L2RAM from L3RAM in the DEMO?
Description of the C74x internal memory is found in the C74x TRM, (search for SPRUH91D on ti.com). The C74x has 256K L2 RAM. This is configured as described in section 4.2 of the TRM as partly cache and partly RAM. The RAM portion is further divided by the demo's BIOS config file (dss_main.cfg) which allocates 16KB of L2 for heap. The linker config file divides it into two halves:
(from SDK 126.96.36.199)
L2SRAM_UMAP1 007e0000 00020000 00020000 00000000 RWIX L2SRAM_UMAP0 00800000 00020000 00016d19 000092e7 RWIX
So it seems that it is all configured as RAM. The failure you are seeing is because a block of 0x10000 will not fit with what is already configured.
The #define SOC_AR16XX_DSS_L2_BUFF_SIZE is from SDK 0.8. In the 188.8.131.52 SDK, the name has changed to MMW_L2_HEAP_SIZE and is set to 0xC000, up from 0x5000.
And yes, L2 RAM will be somewhat faster than L3. L2 typically is accessed at the CPU's clock rate, with no divisions.
In reply to db_woodall:
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.