Tool/software:
Hello,
We have recently been having some issues with bridging on both the TMS320C6414TBGLZA6 and TMS320C6414TBGLZ6 part numbers. We believe it may be due to moisture within the parts, but even after baking are having some issues.
Could you confirm the correct bake out time and temperature for these parts? We believe it to be the 96 hours at 125C as it is a BGA package larger than 17mm x 17mm, but are unsure if this package would meet note 5 which may require a longer bake time than what is listed within the J-STD-033D table.

Additionally, if you have any ideas of why we may be experiencing bridging on these parts all of a sudden - that would be appreciated. As an FYI ~ we have been using these parts since 2011 with no issue.
