Part Number: DS96F173MQML Hello,
Could you please provide a drawing of the recommended land pattern for package LCCC (NAJ) or do you know where I can find one?
Thank you!
Part Number: DS96F173MQML Hello Team,
My customer is looking for the thermal resistance of Junction to Board and Junction to Case now for these chips: 5962-9076501M2A 5962-9076602M2A It seems that the datasheet does not have this information.
Regards…
Part Number: DS96F173MQML Hi,
Is there information on the junction thermal resistance (case, ambient, board)? Looking for info for the this part number: DS96F173ME/883
Part Number: DS96F173MQML Other Parts Discussed in Thread: DS96F175MQML , TINA-TI , , SN65HVD30 Hi team,
I am looking for TINA-TI or SPICE models for the DS96F173MQML/DS96F175MQML When I go to the product page and the Design & Dev tab, the TINA link…
Part Number: DS96F172MQML Other Parts Discussed in Thread: DS96F173MQML , DS90C032QML , DS96F175MQML Hi Team, seeking for the thermal information for these devices.
5962-9076501M2A - Rjc Bottom:
5962-9076602M2A - Rjc Bottom:
5962…
Hello Tyler,
TPS7H1101A-SP: Only available as Known Good Die and ceramic/hermetic package - no outgassing concern.
LMX2615W-MLS: Currently in preview status. Only available in ceramic/hermetic package - no outgassing concern.
DS96F173MQML: Only…