Part Number: MSP430F5324 Other Parts Discussed in Thread: MSP430-FLASHER Tool/software: Hello Team,
I want to use customer bsl MSP430F5324, I saw the MSPBSL 驱动程序或库 | 德州仪器 TI.com.cn but don't find information about how to backup and update bsl firmware.…
Part Number: MSP430F5324 dear
There is different silk screen between sample and mass materials MSP430F5324IRGCR show as below picture，The different it wil influence performance？it will mass product smoothly？thanks in advance
Part Number: MSP430F5324 Other Parts Discussed in Thread: CC1101 , MSP430F5328 MSP430F5324IRGCR High Failure Rate
Failure Details
Mode 1:
Successfully downloaded firmware, but LED D1 is OFF.
Failure rate: 23.75% (1900 out of 8000)
Mode 2:
Successfully…
Part Number: MSP430F5324 Other Parts Discussed in Thread: MSP-FET
I have a very simple program running on an MSP430F5324 which works as expected when I start it using CCS or launch the target configuration in CCS. However, if I power cycle the board…
Part Number: MSP430F5324 Dear TI,
As per MSP430F5324IRGCR datasheet pin 51 and 55 is NC. Does it mean it is physically not connected to the DIE by wire bond?
Also would like to know is there any difference in the leadframe if the country of origins are…
Part Number: MSP430F5324 Dear TI,
As per MSP430F5324IRGCR datasheet pin 51 and 55 is NC. Does it mean it is physically not connected to the DIE by wire bond?
Also would like to know is there any difference in the leadframe if the country of origins are…
Part Number: MSP430F5324 Hi Team,
Here's an issue from the customer may need your help:
test sample:
gold sample:
(The above two is test sample and the others is gold sample in this picture.)
Thanks & Regards,
Yale Li
Part Number: MSP430F5324 Other Parts Discussed in Thread: MSP430F5326 , MSP430F5328 Hi Team,
My understand is that the difference between MSP430F5324, MSP430F5326 and MSP430F5328 is only FLASH and SRAM memory size based on the Table 6-1. Device Comparison…
Part Number: MSP430F5324 Other Parts Discussed in Thread: MSP-GANG Hi team,
When writing using MSP-GANG with the BSL setting with the TEST/SBWTCK pin and RST/NMI/SBWTDIO pin connections reversed, the write operation failed when using an external power…
Yes exactly - and this is precisely why we provide two different pins (Vcc tool and Vcc target) on the MSP-FET & MSP-GANG tool so that the tool correctly is either supplying the voltage (vcc tool) or following the voltage from the board (Vcc target).…
