Part Number: SM320F2812-HT
Tool/software:
Hello,
I am working on a new design and would like to know if either the SM320F2812-HT or SM320F28335-HT are suitable for a new design. The SM470R1B1M-HT was recently obsoleted, I would like to avoid running into another situation like this just a couple years after releasing a new design. The SM320F2812-HT is the older of the two parts, so would it be safer to go with the SM320F28335-HT if both work for my application?
Thanks,
Pierce
Part Number: SM320F2812-HT
Tool/software:
Is this part available in kgd (known good die package) ?
Part Number: SM320F2812-HT
Hi Team，
There's an issue from the customer need your help:
The SM320F2812 chip has 12-bit precision AD. The calculation formula of this AD is based on 3V as a reference, but the power supply is 3.3V. The power supply voltage here is reduced from 3.3V to 3.2V due to temperature. Will it affect the AD collection data? I looked for the data sheet, but I couldn't find what specific AD is used as a reference voltage.
Could you help check this case?
Thanks & Regards,
Ben
Part Number: SM320F2812-HT
Dear e2e Support,
Could you share the storage temperature range for our -HT version (not mentioned in the datasheet)?
Regards,
Part Number: SM320F2812-HT
Hello,
I have a question concerning the pad frame layout for the SM320F2812-HT bare die part. The -HT datasheet shows that there are 201 pads (illustrated in Figure 2-1). However, locations are given for only 179 pads. I assume the reason for this is that the no connect pads are not listed. Do you have any information that includes the no connect pad locations? For my application, I need to be able to visibly identify each pad, regardless of its functionality.
Thank you,
Brandon
Part Number: SM320F2812-HT
Hi,
When was the release date of SM320F2812-HT ?
Is it obsolete ? is Die available ?
for how long can I expect to have this product available to purchase ?
Thanks
ASh
I think the smallest device we have that can hit this temperature is this one https://www.ti.com/product/SM320F2812-HT is right at your size limit.
A quick search across all our MCUs, I cannot find another packaged device that is rated to this temperature range.
Best,
Matthew
Part Number: SM320F2812-HT
When referring to the SPI peripheral block for SM320F2812HFGS150, the device literature implies that only a single SPI slave device can be supported, owing to the allocation of a single ‘SPISTE’ pin.
Are you aware of applications where either: [a] The SPISTE signal is externally multiplexed to address multiple slaves or [b] GPIO pins are utilised as additional slave chip select strobes?
Thanks.
Part Number: SM320F2812-EP
Tool/software:
Hi Team,
My customer is designing with the SM320F2812-EP, but they used the commercial version (TMS320F2812) in their previous builds. They wanted to understand if there are any differences between the two devices outside of the operating temperature?
Regards,
JP
Part Number: SM320F2812-EP
Hello,
I am a senior researcher currently developing a system using the SM320F2812-EP device.
Our application is a battery charger, and we are experiencing an abnormal behavior related to ADC conversion accuracy when the internal temperature rises.
Issue Description
During battery charging, heat generated by other components causes the internal temperature to increase.
When the MCU case temperature exceeds approximately 77°C, the ADC conversion results become increasingly inaccurate.
The abnormal phenomenon observed is:
The measured ADC value becomes lower over time, even though
The OP-AMP output voltage remains higher than the ADC readback value
Additionally, the OP-AMP output voltage increases relative to its input
The OP-AMP is configured as a voltage follower (buffer configuration).
My Current Hypothesis
Temperature increases.
The elevated temperature may cause leakage current in the ADC input MUX FET.
Due to this leakage current, a voltage drop may occur at the sampling node.
As a result, the actual ADC pin voltage remains high, but the ADC digital value decreases over time.
Firmware Workarounds Applied
I implemented the following modifications:
Item Before After
ADC Clock 30 MHz 15 MHz
ADC Sample-and-Hold Clock (ACQ_PS) 16 1
Reason for Firmware Modification
The purpose of these changes was to reduce the ADC sampling window size, with the expectation that it may help mitigate temperature-induced leakage behavior.
Request
Could you please review the following points:
Whether my hypothesis regarding temperature-induced leakage currents affecting ADC sampling accuracy is reasonable.
Whether the applied mitigation strategy (lower ADC clock and shorter sampling window) is appropriate or recommended in this situation.
If available, any design guidelines or best practices to minimize temperature-related ADC accuracy drift with this device.
Thank you in advance for your support.
