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  • SN55LVDS31-SP: Does skew specification cover like-to-like and like-to-unlike edges?

    Resolved
    Part Number: SN55LVDS31-SP Other Parts Discussed in Thread: SN55LVDS31 , I'm trying to verify timing on a project with the SN55LVDS31, however Tsko is somewhat ambiguous. I need to know if the channel-to-channel skew is defined only for like-to-like edges…
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  • SN55LVDS31-SP: Junction-to-Case (top) and Junction-to-Board Thermal Resistances

    Resolved
    Part Number: SN55LVDS31-SP I would like to request the following information for SN55LVDS31-SP 1) Junction-to-Case Thermal Resistance (top) 2) Junction-to-Board Thermal Resistance 3) Weight Thank you in advance. Steve
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  • SN55LVDS31-SP: Junction-to-Case (bottom) Thermal Resistance - Thermal Analysis

    Part Number: SN55LVDS31-SP For board level thermal analysis, do I have to add the solder layer thermal resistance to Junction-to-Case (Bottom) Thermal resistance, when thermal pad is soldered to PCB? Thank you.
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  • SN55LVDS31-SP: package information required for thermal analysis

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    Part Number: SN55LVDS31-SP For thermal analysis of SN55LVDS31-sp , we need following information: · Weight · Component core material · Component package material · Metal lid material · Metal lid coating · Surface color of package (other than…
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  • SN55LVDS31-SP: Footprint inquiry

    TI Thinks Resolved
    Part Number: SN55LVDS31-SP Hi, Greetings! Our customer wants to have the PCB footprint for 5962-9762101VFA [CFP (W) |16 ]. We have checked the datasheet as well as the .bxl file available unfortunately we are not able to find it. I would appreciate if…
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  • SN55LVDS31-SP: package dimensions & material

    Resolved
    Other Parts Discussed in Thread: SN55LVDS31-SP SN55LVDS31-SP Could you let me know the package information as follows? P/N: 5962-9762101VFA ・Package material/ base plating /plating (ex. Ceramic(Alumina)/Ni/Au ・Lid material/ base plating /plating…
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  • SN55LVDS31-SP: Function Table 1 has two G Enables, no Gbar

    TI Thinks Resolved
    Part Number: SN55LVDS31-SP Table 1 of the datasheet appears to have an error, both Enable columns are designated 'G'. I assume the 2nd 'G' column heading should be 'Gbar' to agree with the logic diagram on page 2? Thanks, Ted
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  • SN55LVDS31-SP: Failure effect on LVDS input/outputs when supply exceeds absolute rating

    Resolved
    Part Number: SN55LVDS31-SP Other Parts Discussed in Thread: SN55LVDS32-SP In our application the SN55LVDS31-SP and SN55LVDS32-SP are supplied with 3,3V. The absolute maximum rating is 4,0V. Assuming a failure case were the supply exceeds the maxium…
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  • SN55LVDS31-SP input rise time

    Resolved
    Other Parts Discussed in Thread: SN55LVDS31-SP , SN65LVDS31 Hello, In a new project, we'll use SN55LVDS31-SP drivers between FPGA and ADC. We have two connection options. One SN55LVDS31-SP loaded by 6 ADC, ie like in LVDS-M connection (with one…
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  • SN55LVDS31-SP: Die and Bonding Information

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    Part Number: SN55LVDS31-SP Other Parts Discussed in Thread: SN55LVDS31 Hello, Do you know where I can find the following information for the SN55LVDS31 (Flatpack 16) : - Die Size (mm²) - Wire Bonding Material - Wire Bonding Diameter - Die…
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