Part Number: SN74AHCT244-EP What datasheet parameters are tested as part of production test? Which datasheet parameters are guaranteed by other methods?
Part Number: SN74AHCT244-EP the datasheet for SN74AHCT244DW shows thermal resistance as 83 C/W for DW package 20 pin in table 7.4. the datasheet in SN74AHCT244MDWREP shows thermo resistance as 58 C/W for DM package.
I would think they would be the same…
Part Number: SN74AHCT244-EP Hello Guys,
Good day.
I am not sure if this is the appropriate channel for this but our customer is referring to the document below regarding SN74AHCT244-EP FIT ( Failure-In-TIme). He was not able to find the chi-square numbers…
1. SN74AHCT244 has a drive strength of 8 mA. For a higher drive strength, use the CD74ACT244.
2. SN74ABT244-EP
3. no replacement in the SOIC package
4. SN74AHC573
Daniel,
Mold compound, wafer fab site and assembly site is very proprietary, so we can't have on e2e. What is available is Lead frame finish: https://www.ti.com/product/SN74AHCT244-EP
Under ordering and quality, it says NiPdAu.
Another good resource…
Part Number: SN74AHCT244 Team,
Customer was looking for info regarding the mold compound and considering this is only available via MIC, can we at least make the following statement?
They are trying to move from the non-EP to the -EP variant. and are…
