TPA0211: Package outline

Hi Sasaki-san,

I'm checking this out with our team, will post more details as soon as possible.

Best regards,
-Ivan Salazar
Applications Engineer - Low Power Audio & Actuators

Hi Ivan,

Thank you for your comment. When the customer prepares the land pattern with DGN0008G (large pad), but if assembled device with DGN0008D (small pad) is mounted on the 8G land pattern, will it cause any assemble or thermal performance issues? Also, if applying the small pad pattern (the 8D), I want to confirm if thermal information in the datasheet would be changed or not. 

Best regards,

Takeshi Sasaki

Hi Sasaki-san,

I would not expect a problem if using 8D (small pad) device in 8G (large pad) land pattern.
Thermal information may change, let me address that with our packaging team and let you know the details.

Best regards,
-Ivan Salazar
Applications Engineer - Low Power Audio & Actuators

Hi Ivan,

Thank you for your comment and working with packaging team. Could you share the detail after discussing with packaging team confirming if 8G (large pad) land pattern is ok even when 8D (small pad) will be mounted on it? The customer layout design is temporarily stopped due to this confirmation, and they require the answer asap. 

Best regards,

Takeshi Sasaki

Hi Sasaki-san,

It should be OK to mount small pad device in large pad landing pattern. Only the pad is changing, all other dimensions are kept the same.
Regarding thermal performance, it will take some days for simulation to go down the queue, will keep you updated on this.

Best regards,
-Ivan Salazar
Applications Engineer - Low Power Audio & Actuators

Hi Ivan,

Could you give me comment on following questions?

Q1. Is it correct that the customer should make solder mask pattern as 8D (smaller size), not 8G (larger size)?

Q2. What is the thermal resistance when 8G package is mounted with 8D solder pattern?

Q3. The customer considers if TPA0213 is alternative option of TPA0211. Is TPA0213 right alternative option for TPA0211?

Best regards,

Takeshi Sasaki

Hi Sasaki-san,

Let me comment on your questions:

1. If customer is using the two versions of the package for now, I would suggest to use the larger size of the pad. At the end they should move to the bigger one, correct? If this represents some mechanical or soldering constraint then keep using small pad pattern.
2. I have requested the thermal model of both small and larger pads, but not using the big on the smaller one. In that case I think it should be close to the small one as the thermal connection to the board would be the small pattern.
3. TPA0213 and TPA0211 do not match exactly in terms of functionality, and not pin to pin compatible, although they're similar.

Best regards,
-Ivan Salazar
Applications Engineer - Low Power Audio & Actuators