Hello team,
OTE_THRES of TAS5825M is 160C, but how much is the power dissipation limit determined by package?
Additionally, how about the case that PCB follows 'Layout Guideline' (or EVM)?
Regards,
Kazuto
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Hello team,
OTE_THRES of TAS5825M is 160C, but how much is the power dissipation limit determined by package?
Additionally, how about the case that PCB follows 'Layout Guideline' (or EVM)?
Regards,
Kazuto
Hi Tatsumi-san,
Datasheet chapter 7.4 has the thermal resistance of the TAS5825. You can use the efficiency curve to get the power dissipation, and then estimate the case temperature.
Power dissipation limit is only reflected by the die temperature.
Thanks!
Regards,
Sam