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Hi there,
I'm about to assemble our TAS3251EVM and am hoping you can give some guidance as to how best to solder each side in our reflow oven. Which side do you recommend we reflow first, and therefore twice? Are there any components that you believe should be secured before being reflowed twice to prevent them from falling off?
Many thanks for any tips you can offer!
Kind regards,
Mark
Hi Mark,
The PCB manufacture vendor is actually the expert on this question... For your self-assembling board, I think you can start from the bottom layer(the TAS device is on top layer), because the bottom layer has less components. The high weight components, like the inductors, could be manually soldered after the reflow process.
Thanks!
Regards,
Sam