TPA3255: over temperature protection

Hi,

Is the test done with TI EVM? May I know your output power spec? Like the max output power you would like to get?

As a pad-up device, the power dissipation capability closely depends on the thermal design, like what heatsink you are using, how you made the contact. Could you introduce such details of your thermal design? A photo could help a lot.

Thanks!

Regards,

Sam

hi sam, I found out the reason why device won't woking when I increase the input signal's amplitude. seems like this is not about the OT or heat sink related issue. my input signal is balanced signal and is generated from AP, while I didn't connect the board gnd with AP gnd during the experiment, that's why the device stopping working at larger input signal amplitude. when I reconnect the board GND and AP gnd together, it will survive at larger input signal. But I cannot find out the reasonable reason to explain that. could you help on that?

Hi sam, one more question would like to consult with you, my connection is PBTL and when I'm checking the output waveform on sw_p node and sw_n node, overlap is found out between sw_p and sw_n, especially under heavy loading condition( about 200W), is this normal? could you please help to explain the reason why?

Hi,

It depends on the modulation mode. Could you post a SW_P and SW_N waveform in idle status? 

Thanks!

Regards,

Sam

hi sam, in idle status, duty cycle is around 50% and no overlap is found. under PBTL config, how is the feedback loop working?is it separately or independently?