TPA3116D2: Heatsink Application Inquiry

Renan Santos Adriano

Part Number: TPA3116D2

Hello Team,

My Customer already has the heatsink for the device. However, the assembly people are asking for instruction on how to apply heatsink compound, which best material to use, and screw torque specification? Do we have any info or document referring to this application for they to use?

Regards,

Renan

over 3 years ago

+1 Luis Fernandes de Pina over 3 years ago

TI__Genius 15180 points

Hello Renan,

https://www.ti.com/lit/an/slva462/slva462.pdf is a helpful app note for heatsink design.

We typically use 60-80 Ncm on our EVMs for the screw torque

Please DO NOT use thermal compounds with high electrical conductivity or capacitance, UNLESS you can be certain the compound cannot migrate to the pins of the ICs to which it is applied. Compounds with either of those characteristics can cause partial or near shorts, resistive or capacitive.

We have used Arctic silver Ceramique for our thermal compound.

best regards,

Luis

0 Renan Santos Adriano over 3 years ago in reply to Luis Fernandes de Pina

TI__Mastermind 22380 points

Hello Luis,

thank you for this response. The last question unfortunately we can't find any compound that lists Arctic silver Ceramic material in their data sheet, could you recommend me one? can I use TC3-3.5G from Chipquik?

TC3_3_5G-2511310.pdf

Regards,
Renan

+1 Shadow He over 3 years ago in reply to Renan Santos Adriano

TI__Mastermind 49900 points

Hi Renan

The TC3-3.5G datasheet seems fine, you can use this one.

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TPA3116D2: Heatsink Application Inquiry