TAS5719: Solder stencil and solder mask for Thermal land under TI power amplifier part

John Cerny

Part Number: TAS5719

Hello,

Regarding the solder stencil and solder mask for the TAS5719 audio power amplifier( S-PQFP package), is tenting vias (solder mask) recommended to prevent solder from wicking into the multiple vias (as recommended by TI)? TI recommends 12-13 mil via diameter, and a particular thermal land size to bond to the ThermalPAD on the TAS5719. Will the tents withstand the solder reflow under the part and prevent solder from wicking into the vias?

Curiously,

John Cerny

over 1 year ago

0 Jesse Ji over 1 year ago

TI__Genius 13000 points

Hi John

thank you for your question.

tents should be able to withstand the solder flow.

thanks.

Jesse

+1 John Cerny over 1 year ago

Prodigy 40 points

Thank you Jesse for the confirmation! My concern is whether the solder mask can be precisely deposited over the via without covering too much of the thermal land.

John

0 Shadow He over 1 year ago in reply to John Cerny

TI__Mastermind 34650 points

Hi John

From our experience with EVM production, there should be no problem. But of course we are not professional in the PCB production, maybe you could ask your PCB manufacture side opinion. Thank you.

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TAS5719: Solder stencil and solder mask for Thermal land under TI power amplifier part