Hello,
Regarding the solder stencil and solder mask for the TAS5719 audio power amplifier( S-PQFP package), is tenting vias (solder mask) recommended to prevent solder from wicking into the multiple vias (as recommended by TI)? TI recommends 12-13 mil via diameter, and a particular thermal land size to bond to the ThermalPAD on the TAS5719. Will the tents withstand the solder reflow under the part and prevent solder from wicking into the vias?
Curiously,
John Cerny