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TPA3255: TPA3255 Burned issue

Ning Li
Intellectual 760 points
Part Number: TPA3255


Dears,

Feedback using TPA3255DDVR to do a 300W stereo power amplifier @4Ω, in the PWM simulation sine wave load test, there is a burnt out IC phenomenon, specifically as follows:

1. 300W, stereo, left and right channel, load 4Ω;

2. No burning problem was found in the test with loudspeaker. With 1KHZ sine wave, the analog signal was about 0.75-1.2V, and IC was burned out during the simulation load test

a. IC is more likely to burn out when the input voltage is 51V than when the input voltage is 45V. According to the customer's feedback, the probability of IC burning out is related to the load time.

b. See the DEMO on the official website for the PCB Layout

c. Test 2PCS, all of which showed the above phenomenon

d. After the customer adds a fan under the heat sink, it can work normally. The current design heat sink is larger than the DEMO

Attached are the customer's schematic diagram, PCB Layout and test data. Please help to check the case.

Thanks

TPA3255 Test Data.xlsxF0903-schematic.pdfZY-F0903AMP_V1.0.PCB

  • 0
    TI__Mastermind 20541 points

    Hi Ning

    when the OT happen, does the heat sink feel hot or not?

    is that possible using the thermal imager to confirm what place be hot first? the chip or some component around the chip.

    you can start with a lower voltage to find which place become hot faster.

    your schematic seems no problem.

    the pcb has a little problem, but it should not be a root cause.

    below red circle area be covered by GND, it would be better for heat dissipation.

    thanks.

    jesse

  • 0 in reply to Jesse Ji
    Intellectual 760 points

    Dear Jesse,

    I wiil talk about customer then reply you.

    Thanks