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TPA3223: GND connection of top HeatSink

Guenter Goldbach
Prodigy 80 points
Part Number: TPA3223

The datasheet rrcommend to provide a good GND connection of the heatsink that is connected to to top exposedpad. On the EVM modul this connction is not very good and it fact removing it dos not really change the situation.

What is th idea behind this? Would it b possible to use an isolated thermal pad for heatsink coupling? It would significantly improve EMC in our design?

Guenter

  • 0
    TI__Expert 3540 points

    Hi Guenter 

    From a thermal perspective, both the heatsink and isolated thermal pad can be used. This ground connection requirement is not for device functional. whatever heatsink grounded or not, the device can operate with normal functions and audio performance.

    If you use a metal heatsink, it's recommended to provide a good GND connection, this ground connection requirement is for EMI consideration.