Hi Audio Team,
1) Does the heatsink on the TPA3255 need to be grounded?
2) Does the heatsink need an electrical connection to the "power pad" on the top of the IC, thus grounding the "power pad"?
2b) The answer to question 2 is yes, do we have any recommendations on a thermal interface material (pad or paste) that is electrically conductive and has good thermal performance?
Thanks so much!