Part Number: TAS5825M
I have a design with a three tas5825m with one as a PDTL sub. Currently, the design is a 4 layer board with an internal ground plane.
Does anyone have any recommendations on the copper weights for all layers and the hole size for the vias under the devices .
Currently, I am using 1.5 oz outer and 1oz inner with 20 8mil vias under each device.