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TAS5825M: pcb layer stack recommendations

Part Number: TAS5825M

I have a design with a three tas5825m with one as a PDTL  sub. Currently, the design is a 4 layer board with an internal ground plane.

Does anyone have any recommendations on the copper weights  for all layers and the hole size for the vias under the devices .

Currently, I am using 1.5 oz outer and 1oz inner with 20  8mil vias under each device.