Hi Team,
We are planning to mount Heat sink on TPA3255 IC for effective hear transfer- However we would like to clarify below points before proceeding-
- What would be the max pressure/torque that can be applied on TPA3255 IC
- What is the precautions to be taken care while mounting the Heatsink
- What is the recommended thermal element to be applied b/w ICTPA3255 and Heatsink
- The Heatsink has 1 mm gap for IC – where as IC height can vary up to 1.2mm max – ( Is 0.2 mm compression on IC is okay?)
Thanks & Regards,
Pradeep