Other Parts Discussed in Thread: TAD5112
Our SMT engineers are struggling to successfully solder device PCM1770PW to our customers PCBA due to the lead finish being Nickel Paladium Gold (NiPdAu). We are experiencing prolific insufficient solder joints on various builds.
Could someone please confirm if this component can be provided such that the finish on the leads is different and more lending to use at SMT e.g. tin plated. Or can TI recommend an alternative component?
