Hi team,
why we design such a thermal pad for TAS6511 ,could you pls help to explain?

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Hi team,
why we design such a thermal pad for TAS6511 ,could you pls help to explain?

Because from our insights, such a pad isn’t common
One more question, for this device, we can find the one page from the TI.com, does all the specs have been tested in lab room ?
Hi Eric
This headframe is an already existing one in TI, not specially designed for this device. And the effective part is the center rectangle, the small part only for support.
One more question, for this device, we can find the one page from the TI.com, does all the specs have been tested in lab room ?
Not fully understand your question.
This device haven't RTM yet, and is still testing by our validation team, in the lab.
Hi Shadow,
do you mean that all the first page specs have not tested, those specs just the parameters we want to realize but have not been validated?