TPA3110D2: TPA3110D2PWPR

Hi Sai, 

The schematic looks fine. For the layout, The only major thing I would change is the thermal pad on the layer with the amp. Given this is a pad down device, the largest impact on thermal performance is the ground layout near the device. Your ground layers are great and the opposite side of the board is good with the large plane, but the top layer near the device is restricted thermally. I would recommend to take the point where the 12V comes up to the device on the left side of the board and rotating it 90 degrees such that the ground plane under the device has more area to spread out to. In an ideal world you would do this on both sides of the device, but given the proximity to the edge of the board this would only be helpful if the whole device and supporting circuitry is moved further from the edge. If you look at the example layout in the EVM user's guide, you can see how the top and bottom of the device are exposed to a large ground plane with no bottlenecks.

A small nitpick I have is to add a few more ground vias on the ground near the output filter capacitor. You have good grounding and a nice solid ground plane, but only three vias in that section of the board tying them together. I would make the three vias into a 2x3 matrix. As it is it will be fine, but there is no reason to not add them.

Regards,

Ramsey

hi Sai

i haven't find amplifier IC on PoE section.

do you mean TPS device? please submit another e2e for this device for that belongs to other team.

tks

jesse