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Original question:

TPA3255: Precautions and guidelines to mount Heatsink over TPA-3255 IC package

TPA3255: TPA3255 EVM board

Pradeep k
Prodigy 40 points
Part Number: TPA3255

Tool/software:

Hi Team 

I need below clarification on  TPA3255 EVM Board and ATS-Quats Heatsink assembly 

1. How is the assembly of TPA3255 & EVM Board heatsink is assembled  ,  Is there we have any Airgap ? or its face to face connection assembly ?

2. What is the TIM-Thermal interface material used in between TPA3255 & Heatsink used in Ti EVM Board ?

  • 0
    TI__Genius 15250 points

    hi k

    heat sink has to be as close as to the thermal pad of the chip.

    we apply a little thermal grease on the thermal pad, then assemble heat sink on above of the chip.

    the screw be use to tighten the heat sink to the evm to make sure heat sink is as close as to the chip thermal pad. the force be less than 100N is ok for chip. just make sure heat sink will not be loose and is as close as to the chip.

    tks

    jesse

     

  • 0 in reply to Jesse Ji
    Prodigy 40 points

    Hi Jesse

    1. What is the specification of thermal grease you used? Could you please provide a part number for thermal grease? 

    2. What is the maximum gap you kept in between Heatsink and Chip ( Since Chips upper limit tolerance is 0.2mm ) 

  • 0 in reply to Pradeep k
    TI__Genius 15250 points

    hi, k

    1.we don't have special thermal grease to recommend. usually we choose that has high thermal conductivity.

    2.we don't have that kind of spec. usually, just tighten the heat sink with pcb and make sure thermal pad be as close as to the heat sink.

    maybe how much force be applied to the screw might be better. <100N force on the chip will not damage the chip.

    tks

    jesse