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Original question:

ULN2003A: Application Issue due to Change Mexico device to Malaysia device

NE5532A: NE5532A parts from Malaysia different from Mexico production

David Goodman
Prodigy 15 points
Part Number: NE5532A


Tool/software:

Dear TI support

We have a problem with production failures from our factory caused by the NE5532A.
We have been running production with the Mexican produced NE5532A IC for 3 years without any problems.
The recent batch of NE5532As from Malaysia have been built into our product and we are seeing 1dBu variations at certain frequencies.
To verify the NE5532A is causing this problem, we swapped the IC on a few units from the Malaysian made part to the Mexican. Once modified the fault is gone. Replacing the Malaysian parts back on the boards causes the fault to appear once again.
We are concerned that such a precision audio part has over 1dBu variations at certain frequencies.
Looking through the TI support forum we can see tickets concerning the TI production move from Mexico to Malaysia. You should be aware the NE5532A is also affected by this change in production.

Please find pictures attached the batch information and part to show these are genuine parts.
The limit lines from the responses have been optimised with over 10k units. But this IC batch fails testing (see picture below)
It looks like the frame and package material is different between the two manufacturers.

Please correct this for future production.

  • 0
    TI__Guru* 77541 points
    David Goodman said:
    Looking through the TI support forum we can see tickets concerning the TI production move from Mexico to Malaysia. You should be aware the NE5532A is also affected by this change in production.

    There is PCN issues released on the product about the FAB changes (include design change) in Nov., 2023. The differences between the product are likely related to old and post-PCN products. Not necessarily the manufacture location differences, since the part manufactured in Mexico is the old or pre_PCN Si die and the part manufactured in Malaysia is the new or post-PCN product. 

    https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/5726/PCN20231114002.1.pdf

    David Goodman said:
    The limit lines from the responses have been optimised with over 10k units. But this IC batch fails testing (see picture below)
    It looks like the frame and package material is different between the two manufacturers.

    Currently, both old and post-PCN are shipped from sale office, and the post-PCN product will be the only product once the old inventory is depleted from manufacturing site. The post_PCN manufactured in Malaysia site will be the final Si-design. 

    I see the differences in the attached plot above, but I do not know the reasons. Could you send me the schematic and I will take a look at the design. In theory, the post-PCN should be equivalent to the old product, but it may have certain differences due to FAB changes, such as BW, input Vcm, output variations etc. in actual circuit and resulted the differences in your existing pass/fail requirements. I do not want to speculate what is the root causes of your "failed" tests. Please let me know. 

    If you do not want to post the schematic in E2E public forum, please submit a "friendship" request via E2E private messaging system. 

    Best,

    Raymond

  • 0 in reply to Raymond Zhang1
    Prodigy 15 points

    Many thanks Raymond for looking into this and for you offer to look over the schematics.
    We will be making changes to the design.