TAS5815: Heat sink installation question

Zach Zhu

Part Number: TAS5815

Tool/software:

Hi expert,

Please help confirm, TAS5815 is bottom heat dissipation. If a heat sink is added, should it be installed on the PCB on the back of the chip or on the top of the device?

BR,

Zach

3 months ago

0 Wenbin Li1 3 months ago

TI__Intellectual 2190 points

Hi Zach，

in fact, you can refer to the answer of below link.

https://e2e.ti.com/support/audio-group/audio/f/audio-forum/1464985/tas5827-heat-sink-options?tisearch=e2e-sitesearch&keymatch=heat%25252525252520sink#

I paste the answer here for your convience.

"With a good PCB layout that has good thermal considerations (large clean ground planes, thermal vias), customer can rely on the PCB. Of course adding a heatsink to the device can also help get slightly more out of it. If the heatsink is wanted to be on the top of the package, the heatsink should have a gap of 1mm for the device. If a heatsink is wanted on the other side of the PCB, then it should be flat to mesh with the PCB."

and regarding the mechanical design, you can refer to the below one although it is not audio PA.

https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1276203/lmg3522r030-recommendation-for-top-side-and-bottom-cooling

Br,

Wenbin

Audio

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TAS5815: Heat sink installation question