Part Number: PGA2311
Other Parts Discussed in Thread: TLV320AIC3104, , TPA6120A2
I’m working on a mixed-signal audio board and would really appreciate some feedback regarding my layout and grounding strategy.
On the left side of the board, I have:
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TLV320AIC3104 (audio codec)
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PGA2311 (digitally controlled volume)
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LDO regulators (3.3V and 1.8V)
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TXU level shifter for SPI communication
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MCU feeding I2S to the codec and SPI to the PGA (through the level shifter)
On the right side, I have:
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TPA6120A2 headphone amplifier
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Analog output routing and output connectors
I have physically separated the digital/control section and the analog amplifier section. AGND and DGND are isolated in layout and connected using a star grounding approach at a single point.
For testing flexibility, I have placed jumpers between the PGA output and the TPA input.
My Questions:
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With this placement (digital on left, analog on right), is there a chance of noise coupling from:
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I2S lines?
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SPI signals through the level shifter?
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The jumpers between PGA and TPA?
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Is star grounding still recommended in this type of audio design, or would a continuous ground plane be better?
I’m mainly concerned about maintaining low noise performance in the headphone amplifier stage.
Any guidance or layout suggestions would be very helpful.
