Other Parts Discussed in Thread: TPA6017A2
when we design TPA6017A2 than it's become over heating and out put become drop, what should I do in this situation?
is TPA6017A2 different with LM4874 ?
pleas advice me
thanks..
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Other Parts Discussed in Thread: TPA6017A2
when we design TPA6017A2 than it's become over heating and out put become drop, what should I do in this situation?
is TPA6017A2 different with LM4874 ?
pleas advice me
thanks..
Yusup,
What are your operating conditions: supply, load, output power, ambient temp, when you expereince the output power drop? Can you find out what the temperature is at the package? Is the exposed DAP properly soldered to the PCB?
Please refer to pages 22-24 in the datahsheet for output power vs. ambient temperature guidlines. Also make sure the DAP is connected to a large plane of copper, prefereably the GND plane. Increasing the widths of the output, power and GND traces will also help dissipate heat from the package.
The TPA6017 is a pin for pin replacement of the LM4874, however, the LM4874 is obsolete.
Regards,
royce