I sent the following email to TI support and a computer-generated message told me that to serve me better I was being directed to this forum:
I am very interested in your TAS5630B class D amplifier.
The datasheet shows that both available packages have PowerPADs on the TOP side.
The datasheet also recommends the TI Lit Nos SLMA002 and SLMA004 to understand how to best dissipate the heat from the PowerPAD.
However, both SLMAs deal only with PowerPADs on the BOTTOM of a package.
It appears that the recommended SLMAs are of no benefit whatsoever to someone who wants to provide heatsinking for the TAS5630.
Am I missing something here?
Can you please send me complete information as to how to best heatsink the TAS5630B that has a PowerPAD on TOP and not on the BOTTOM?