Hello,
I am using the OPA1632 in the MSOP-Powerpad package.
In the datasheet there is the following statement
"The OPA1632 MSOP-8 package version incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally-dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature, which can permanently damage the device. See TI technical brief SLMA002 for more information about using the PowerPAD thermally-enhanced package."
This note is very ambiguous and does not state to which voltage the thermal pad can be connected to. In my design I have +12V, -12V, and GND.
VOCM is connected to GND in my design.
To which of these 3 voltages do I connect the thermal pad?
Thanks;
Leonid
