TLV320ADC3001 PCB routing

Hi, Graham,

I've asked my colleague to comment on your post.

-d2

Thank you

Hi, it's just the 4 internal pins on the BGA that I could do with some guidance on, and placement of capacitors.

Thanks,

Graham

Can anyone help? It seems a bit strange to me that there is no documentation at all for this?

Thanks,

Graham

Hi, Graham,

Apologizes for the delay. We will get back to you by mid next week with some suggestions.

-d2

Hi,

Any progress on this?

G

I have been asked to post a reminder to trigger a reminder for the forum engineers.

G

Does anyone else actually use this part?

G

Just unbelievable......

I guess tomorrow I look at using a competitors part.

I have the whole routing done on a board apart from this part, it is holding up the whole project.

G

There are two ways how you can escape route the internal pads of the ADC3001's BGA footprint:

1. Use a 3 mil trace/space PCB process and use 3 mil traces to route the inside pads to decoupling capacitors that are placed as close as possible to the ADC3001.

2. Use filled vias (e.g. epoxy filled and ground down) to connect the pads (all are power/ground) to internal power or ground planes on your PCB. Add decoupling capacitors as close to the part as possible.

For decoupling capacitors, use 100nF parallel to 1uF chip capacitors with the appropriate voltage ratings.

I recommend the second option if this is acceptable from a PCB fab point of view.

A good article with further tips is here: http://www.pcb-experts.com/Escape-routing-under-fine-pitched-BGAs.html